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عنوان
Advanced MEMS packaging
پدید آورنده
John H. Lau [and others].
موضوع
Microelectromechanical systems.,Microelectronic packaging.,TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
رده
TK7875
.
J646
2010
کتابخانه
کتابخانه مطالعات اسلامی به زبان های اروپایی
محل استقرار
استان:
قم
ـ شهر:
قم
تماس با کتابخانه :
32910706
-
025
0071626239
0071627928
0071741836
1615831592
9780071626231
9780071627924
9780071741835
9781615831593
b620342
Advanced MEMS packaging
[Book]
John H. Lau [and others].
New York
McGraw-Hill
©2010.
(xxiii, 552 pages) : illustrations
McGraw-Hill's AccessEngineering
Introduction to MEMS --; Advanced MEMS packaging --; Enabling technologies for advanced MEMS packaging --; Advanced MEMS wafer-level packaging --; Optical MEMS packaging : communications --; Optical MEMS packaging : bubble switch --; Optical MEMS : microbolometer packaging --; Bio-MEMS packaging --; Biosensor packaging --; Accelerometer packaging --; Radiofrequency MEMS switches --; RF MEMS tunable capacitors and tubable band-pass filters --; Advanced packaging of RF MEMS devices.
Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices. --
Advanced microelectromechanical systems packaging
Microelectromechanical systems.
Microelectronic packaging.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
TK7875
.
J646
2010
John H. Lau [and others].
John H Lau
مطالعه متن کتاب
[Book]
Y
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