عنوان

Electromigration in thin films and electronic devices :

شابک

1845699378

شابک

9781845699376

شماره

b515319

عنوان اصلي

Electromigration in thin films and electronic devices :

نام عام مواد

[Book]

ساير اطلاعات عنواني

materials and reliability /

نام نخستين پديدآور

edited by Choong-Un Kim

محل نشرو پخش و غیره

Philadelphia :

نام ناشر، پخش کننده و غيره

Woodhead Publishing,

تاریخ نشرو بخش و غیره

c2011

نام خاص و کميت اثر

xiii, 340 p. :

ساير جزييات

ill. ;

ابعاد

25 cm

عنوان فروست

Woodhead Publishing in materials

متن يادداشت

Includes bibliographical references and index

متن يادداشت

Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht

بدون عنوان

0

موضوع مستند نشده

Electrodiffusion

موضوع مستند نشده

Integrated circuits-- Deterioration

موضوع مستند نشده

Interconnects (Integrated circuit technology)

موضوع مستند نشده

Thin films

شماره رده

نشانه اثر

مستند نام اشخاص تاييد نشده

Kim, Choong-Un

تاريخ عمليات

20111216114806.0

نام الکترونيکي

نوع ماده

[Book]

تكميل شده

Y