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<3D> IC stacking technology
پدید آورنده
موضوع
Three-dimensional integrated circuits,Microelectronic packaging,TECHNOLOGY & ENGINEERING / Electronics / Semiconductors, bisacsh
رده
TK
,
7874
.
893
,.
A14
,
2011
کتابخانه
Library of Urmia University of Technology
محل استقرار
استان:
West Azarbaijan
ـ شهر:
Urmia
تماس با کتابخانه :
31980284
-
044
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
978-0-07-174195-8
English Book
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
<3D> IC stacking technology
Subsequent Statement of Responsibility
Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors
EDITION STATEMENT
Subsequent Statement of Responsibility
1st ed.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
McGraw-Hill Professional,
Date of Publication, Distribution, etc.
2011
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xviii, 521 p. , ill.
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
TOPICAL NAME USED AS SUBJECT
Entry Element
Three-dimensional integrated circuits
Entry Element
Microelectronic packaging
Entry Element
TECHNOLOGY & ENGINEERING / Electronics / Semiconductors, bisacsh
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
,
7874
.
893
,.
A14
,
2011
PERSONAL NAME - SECONDARY RESPONSIBILITY
Entry Element
Wu, Banqiu.
Entry Element
Kumar, Ajay.
Entry Element
Ramaswami, Sesh.
Relator Code
Editor
Relator Code
Editor
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